Quality Control

Every product undergoes rigorous testing before shipment — from component screening to batch traceability.

1

Platform Verification

All NAND flash chips and memory ICs are verified against manufacturer specifications before production.

2

Component Screening

Incoming components undergo electrical parameter testing, visual inspection, and compatibility verification.

3

Aging & Burn-in Test

Every batch passes through 48-hour aging tests at elevated temperatures to identify early failures.

4

Batch Traceability

Full lot tracking from raw materials to finished goods — every unit is traceable to its production batch.

Test Items

Electrical parameter testing (read/write speed, latency)
Temperature cycling (-20°C to 70°C)
Endurance testing (TBW verification)
Compatibility verification across platforms
Vibration & shock resistance testing
Data retention validation

Certifications & Compliance

Products are tested and certified for international markets — CE, FCC, RoHS, and ISO 9001 quality management.

Our certificate wall — awards, patents & compliance certifications
Our certificate wall — awards, patents & compliance certifications

CE Certified

EU safety, health, and environmental compliance

FCC Compliant

US electromagnetic compatibility standards

RoHS Compliant

Free of restricted hazardous substances

ISO 9001

Certified factory quality management system

Certificate copies and third-party test reports are available upon request.